TDK Showcases Solutions for Automotive, AR/VR, IoT, Mobile and Wearables at CES 2019
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TDK Corporation brings together the industry’s most comprehensive
portfolio of sensors and passive components marketed under brands TDK,
InvenSense, Micronas, Chirp, Tronics and EPCOS. -
Solutions are showcased in real-world applications such as AR/VR,
automotive, drones, sound systems, wearables and more. -
New, groundbreaking InvenSense sensors will be launched at the
exhibition.
SAN JOSE, Calif.–(BUSINESS WIRE)–TDK Corporation (TSE:6762) will present the industry’s single source of
innovative sensor, passive components and electronics solutions marketed
under brands TDK, InvenSense, Micronas, Chirp, Tronics and EPCOS in
Booth #30306, Las Vegas Convention Center, South Hall 3, at CES
2019, January 8-11, Las Vegas, Nev.
To meet the growing industry demand to humanize the digital experience,
TDK is advancing new materials, achieving production process control at
nanometer levels, and manufacturing to zero defect standards, to offer
passive components, sensors, sensor solutions and platforms for mobile,
wearable, AR/VR, automotive, Internet of Things (IoT), drone and
industrial applications.
At the forefront of pioneering six degrees of freedom (6DoF) solutions,
TDK delivers InvenSense core competencies of 6-axis motion sensing with
Chirp sonar and high-performance TMR magnetometers in a single platform
integrated with fusion software. TDK will launch several new InvenSense
sensors, including a line of motion sensors optimized for head-mounted
displays and another for handheld controllers. TDK will
also unveil new sensors with unique 7-axis fusion technology, and the
world’s first high-precision, inertial-aided positioning software
solution for autonomous vehicles.
OEMs are invited to learn about market advancements, developments and
solutions to design concerns.
Booth highlight demonstrations include:
TDK PiezoHapt™: TDK expands its portfolio of haptic components
with the ultra-thin PiezoHapt™
actuator featuring a very short response time. Available in two forms,
as a single layer monolithic piezo ceramic disk and as a multilayer
actuator with mechanical amplifiers, these new active haptic solutions
with “button-like” feedback feature very low-insertion heights tailored
for a comprehensive range of consumer/industrial displays as well as for
automotive use.
TDK PowerHap™: The PowerHap™
piezo actuator with haptic feedback and integrated sensor functionality
is a compact actuator that significantly enhances the sensory experience
of the human-machine interface. PowerHap actuators feature high
acceleration and force, low insertion height and a fast response time
for use in automotive flat panel consoles, single button replacement and
navigation systems; consumer electronics displays (e.g., flat panel TVs,
smartphones and tablets, AR/VR, game controllers and wearables); smart
appliances and industrial displays.
TDK PiezoListen™: World’s first piezo-based, ultra-thin
(thickness of 0.45 to 0.7mm), high-power actuator converts flexible
surfaces into speakers in automotive infotainment systems and
flat screens. Unlike typical miniature speakers that tend to have a
metallic sound, PiezoListen produces sound with dynamic range, volume
and richness (midrange and high-end) that easily fills a room or vehicle.
Micronas 3D Position Hall Sensor: New Hall sensor, HAL®
39xy, features stray field compensation built on a flexible
architecture for multidimensional magnetic field measurements. The
sensor offers four measurement modes in a single device: 1) linear
position detection, 2) rotary 360° angle detection, 3) rotary 180° angle
detection with stray field compensation including gradient fields, and
4) real 3D magnetic field measurement (BX, BY, BZ).
Tronics High-Performance MEMS Inertial Sensors (Gyros and
Accelerometers): New MEMS inertial
sensors feature closed-loop electronics for superior linearity,
increased signal-to-noise ratio and improved behavior under vibration,
shock and extreme temperature environments. Available in hermetically
sealed ceramic packages for extended lifetimes in adverse environments.
TDK CeraPlas™ HF: New CeraPlas
HF is a compact cold plasma generator element based on a PZT (lead
zirconate titanate) that is low weight, consumes little power and
requires low input voltage. The cold plasma generator ionizes multiple
gases – including air – under normal pressure. Ideal for battery-powered
handheld devices, CeraPlas can be used to treat plastics for easier
imprinting, disinfect wounds, sterilize devices or foods, and eliminate
unpleasant odors.
Chirp ToF Sensor: World’s first MEMS ultrasonic time-of-flight
(ToF) sensor
consumes only microwatts while performing ultrasonic echolocation. The
new inside-out 6DoF Ultrasonic Controller Tracking Solution for
All-in-One VR is a tiny “sonar on a silicon chip” enabling ultrawide
field-of-view, inside-out controller tracking for mobile VR/AR at 1/1000
power of other solutions.
About TDK Corporation
TDK Corporation is a leading electronics company based in Tokyo, Japan.
It was established in 1935 to commercialize ferrite, a key material in
electronic and magnetic products. TDK’s comprehensive portfolio features
passive components such as ceramic, aluminum electrolytic and film
capacitors, as well as magnetics, high-frequency, and piezo and
protection devices. The product spectrum also includes sensors and
sensor systems such as temperature and pressure, magnetic, and MEMS
sensors. In addition, TDK provides power supplies and energy devices,
magnetic heads and more. These products are marketed under the product
brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK
focuses on demanding markets in the areas of information and
communication technology and automotive, industrial and consumer
electronics. The company has a network of design and manufacturing
locations and sales offices in Asia, Europe, and in North and South
America. In fiscal 2018, TDK posted total sales of USD 12 billion and
employed about 103,000 people worldwide.
Contacts
TDK
TDK Corporation of America
Ms. Sara M. Lambeth, +1
972-409-4519
sara.lambeth@us.tdk.com
Karbo Communications
Ms. Kim Lianthamani, +1 415-255-6512
TDKUSA@karbocom.com
EPCOS/TDK
TDK-Electronics Inc.
Ms. Debbie Martin, +1
732-906-4364
debbie.martin@tdk-electronics.tdk.com
InvenSense/Chirp
InvenSense/Chirp Microsystems
Mr.
David A. Almoslino, +1 408-501-2278
pr@invensense.com
Micronas
TDK-Micronas
Mr. David Karlinski, +1
248-346-0808
David.Karlinski@Micronas.com
Tronics
Tronics Microsystems
Mr. Karl Biasio, +33 (0)4
76 97 94 59
karl.biasio@tronicsgroup.com
