Chirp Microsystems and Qualcomm Technologies, Inc. collaborate to bring inside-out 6-DoF controller tracking to mobile VR/AR headsets

• Joint effort pairs Chirp’s ultrasonic technology with the Qualcomm^®
  Snapdragon^™ Mobile XR (VR/AR) Platform to enable
  ultra-wide field-of-view, inside-out controller tracking for mobile
  VR/AR at 1/100 power of other solutions.

LAS VEGAS–(BUSINESS WIRE)–TDK Corporation (TSE: 6762) announced it is working with Qualcomm
Technologies, Inc. through its group company, Chirp Microsystems, to
make inside-out six degree-of-freedom (6-DoF) controller tracking
available to mobile VR/AR head-mounted displays (HMDs) powered by
Snapdragon Mobile XR Platforms. For Chirp, today’s announcement further
validates Chirp’s ultrasonic tracking technology as the optimal solution
for mobile VR/AR systems, offering high-precision, low latency tracking
with low power consumption and near-zero computation cost.

Powered by Chirp’s CH-101 digital ultrasound transceiver, the 6-DoF
controller tracking system is based on Chirp’s SonicTrack^TM
ultrasonic sensor fusion library that is optimized for the Snapdragon
Mobile XR Platform to provide ultra-low power, high-precision,
drift-free tracking of hand-held gaming controllers.

“Our ultrasonic controller tracking solution is enabled by the CH-101
ultrasonic transceiver, the lowest power, smallest size ultrasonic
transceiver on the market today,” said Michelle Kiang, CEO of Chirp
Microsystem. “The power required by the tracking system is only a few
milliwatts – about a hundred times less than an optical tracking system.
More importantly, it requires minimal computation power to calculate the
controller location compared to that needed in computer vision based
tracking systems, allowing more processing power to be preserved for
graphic rendering and tasks. Ultrasonic tracking also allows us to offer
an incredibly wide field-of-view so that the HMD never loses track of
the controllers as the user moves around. These features make our
tracking solution really well-suited to mobile VR and AR systems where
heat dissipation and short battery life are killer problems. We couldn’t
imagine a better collaborator for the mobile industry than Qualcomm
Technologies.”

“Qualcomm Technologies is a leader in mobile technologies for next
generation XR entertainment and productivity experiences,” said Ziad
Asghar, VP of product management, Qualcomm Technologies, Inc. “Chirp’s
ultrasonic tracking technology offers high-performance tracking and low
computation cost for mobile VR. By utilizing Chirp’s technology with our
Snapdragon Mobile XR platform, XR OEMs can create truly untethered,
immersive experiences.”

Chirp Microsystems, a TDK group company, will be at the upcoming CES
2019, showcasing the Chirp SonicTrack platform, along with a
comprehensive portfolio of sensors, electronic components and solutions
for mobile, wearables, AR/VR, automotive, IoT and industrial
applications in Booth #30306, Las Vegas Convention Center, South Hall 3,
January 8-11, Las Vegas, Nevada. Please visit: www.chirpmicro.com
or contact Chirp Sales at sales@chirpmicro.com
for more information.

Glossary

• 6-DoF: Six Degrees of Freedom (Three degrees of x-y-z SHIFT and three
  degrees of x-y-z ROTATION)
• 3D: three-dimensional
• FoV: Field of View
• AR/VR/XR: Augmented Reality / Virtual Reality / Extended Reality
• Ultrasonic: Utilizing, produced by, or relating to ultrasonic
  waves or vibrations

Main applications

• AR/VR/XR
• Smart home
• Drone and robotics
• Connected IoT devices
• Mobile and wearable
• Automotive

Key features and benefits of the Chirp SonicTrack ultrasonic
controller tracking solution:

• Mobile optimized – ultralow power, light weight and does not require
  base station
• Near-zero computation load
• Works under any lighting condition
• Expanded Field of View (FoV)

About TDK Corporation

TDK Corporation is a leading electronics company based in Tokyo, Japan.
It was established in 1935 to commercialize ferrite, a key material in
electronic and magnetic products. TDK’s comprehensive portfolio features
passive components such as ceramic, aluminum electrolytic and film
capacitors, as well as magnetics, high-frequency, and piezo and
protection devices. The product spectrum also includes sensors and
sensor systems such as temperature and pressure, magnetic, and MEMS
sensors. In addition, TDK provides power supplies and energy devices,
magnetic heads and more. These products are marketed under the product
brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK
focuses on demanding markets in the areas of information and
communication technology and automotive, industrial and consumer
electronics. The company has a network of design and manufacturing
locations and sales offices in Asia, Europe, and in North and South
America. In fiscal 2018, TDK posted total sales of USD 12 billion and
employed about 103,000 people worldwide.

About Chirp Microsystems

Chirp Microsystems, a TDK group company, is bringing ultrasonics to
everyday products. Chirp’s piezoelectric MEMS ultrasonic transducers
offer long range and low power in a tiny package, enabling products that
accurately perceive the 3D world we live in. Combined with Chirp’s
embedded software library, these sensors advance user experiences with
VR/AR, wearables, robotics, drones and occupancy detection. For more
information, please visit: www.chirpmicro.com

Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated,
registered in the United States and other countries.

Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc. and/or
its subsidiaries.

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Contacts

Chirp Microsystems
Mr. David A. ALMOSLINO
+1 408-501-2278
pr@invensense.com

Karbo Communications
Ms. Kim LIANTHAMANI
+1 415-255-6512
TDKUSA@karbocom.com